The LTC3108IGN#PBF is a surface-mount lead-frame SMT device with a 16-pin SSOP N package. It is a specialized power management IC designed for step-up converter applications. The device operates over a temperature range of -40°C to 125°C and is suitable for use in plastic packages.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP N |
| Package Description | Shrink Small Outline Package Narrow Body |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 4.98(Max) |
| Package Width (mm) | 3.99(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 0.64 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-137AB |
| Category | Step-Up Converter and Power Manager |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Analog Devices LTC3108IGN#PBF to view detailed technical specifications.
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