PackageMSOP EP
MountingSurface Mount
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Technical Specifications
Analog Devices LTC3588IMSE-1#PBF technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
MSOP EP
Package Description
Micro Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
10
PCB
10
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.86
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-187BA-T
Category
Piezoelectric Energy Harvesting Power Supply
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices LTC3588IMSE-1#PBF Datasheet
Download the complete datasheet for Analog Devices LTC3588IMSE-1#PBF to view detailed technical specifications.
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