PackageBGA
MountingSurface Mount
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Technical Specifications
Analog Devices LTM4601HVEY#PBF technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 118 |
| PCB | 118 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 2.82 |
| Seated Plane Height (mm) | 3.42 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Isolation | Non-Isolated |
| Type | Step Down |
| Number of Outputs | 1 |
| Minimum Input Voltage | 4.5V |
| Output Voltage | 0.6 to 5V |
| Maximum Input Voltage | 28V |
| Maximum Output Current | 12A |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Analog Devices LTM4601HVEY#PBF Datasheet
Download the complete datasheet for Analog Devices LTM4601HVEY#PBF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.