This 160-pin BGA surface mount modem IC is a plastic ball grid array package with a pin count of 160. It features a basic package type of Ball Grid Array and is designed for surface mount applications. The IC is manufactured by Broadcom and is a part of the category of modems.
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Broadcom 1675BAV2RDD12V-DB technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 160 |
| PCB | 160 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 50434 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
Download the complete datasheet for Broadcom 1675BAV2RDD12V-DB to view detailed technical specifications.
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