System-On-Chip (SoC) featuring a MIPS32 core operating at a maximum clock rate of 266 MHz. This surface-mount device is housed in a 324-pin, 23mm x 23mm x 0.87mm plastic Ball Grid Array (BGA) package. It offers integrated Ethernet (2 ports), I2S, IrDA, and UART (4 ports) interfaces, along with a single USB port. The SoC operates at a typical 1.5V supply voltage and includes 32 programmable I/Os.
PackageBGA
MountingSurface Mount
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Technical Specifications
Broadcom Au1000-266MCC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
0.87
Package Material
Plastic
Mounting
Surface Mount
Family Name
Au1000
Device Core
MIPS32
Maximum Clock Rate
266MHz
Program Memory Type
ROMLess
Maximum Speed
266MHz
Type
System-On-Chip
Processing Unit
Microprocessor
Typical Operating Supply Voltage
1.5V
Number of Programmable I/Os
32
Interface Type
Ethernet/I2S/IrDA/UART/USB
SPI
0
I2C
0
I2S
0
UART
4
USB
1
USART
0
CAN
0
Ethernet
2
Programmability
No
Compliance
Cage Code
50434
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Broadcom Au1000-266MCC Datasheet
Download the complete datasheet for Broadcom Au1000-266MCC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.