System-On-Chip (SoC) featuring a MIPS32 core operating at a maximum clock rate of 266 MHz. This surface-mount device is housed in a 324-pin BGA package with a plastic ball grid array construction, measuring 23 x 23 x 0.87 mm. It offers a typical operating supply voltage of 1.5 V and includes interfaces for Ethernet (2), I2S, IrDA, UART (4), and USB (1). The processing unit is a microprocessor with 32 programmable I/Os and a ROMLess program memory type.
PackageBGA
MountingSurface Mount
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Technical Specifications
Broadcom Au1000-266MCD technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
0.87
Package Material
Plastic
Mounting
Surface Mount
Family Name
Au1000
Device Core
MIPS32
Maximum Clock Rate
266MHz
Program Memory Type
ROMLess
Maximum Speed
266MHz
Type
System-On-Chip
Processing Unit
Microprocessor
Typical Operating Supply Voltage
1.5V
Number of Programmable I/Os
32
Interface Type
Ethernet/I2S/IrDA/UART/USB
SPI
0
I2C
0
I2S
0
UART
4
USB
1
USART
0
CAN
0
Ethernet
2
Programmability
No
Compliance
Cage Code
50434
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542390000
ECCN
5A991.b
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Broadcom Au1000-266MCD Datasheet
Download the complete datasheet for Broadcom Au1000-266MCD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.