The BCM6411IPB is a specialized telecom IC packaged in a 336-ball BGA, suitable for surface mount applications. It has a plastic package material and measures 27mm in length and width. The IC is designed for use in telecommunications systems and is available from Broadcom.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 336 |
| PCB | 336 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 50434 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Broadcom BCM6411IPB to view detailed technical specifications.
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