PackageBGA
MountingSurface Mount
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Technical Specifications
Broadcom BCM6411IPB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
336
PCB
336
Package Length (mm)
27
Package Width (mm)
27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
50434
EU RoHS
No
HTS Code
8542310001
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Broadcom BCM6411IPB Datasheet
Download the complete datasheet for Broadcom BCM6411IPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.