The BCM8152CIFBG is a 301-pin Ball Grid Array Ethernet PHY IC from Broadcom. It features a plastic ball grid array package with a length and width of 15mm. The IC is designed for surface mount applications. The operating temperature range is not specified in the provided data.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 301 |
| PCB | 301 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 50434 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 5A991.b.1 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Broadcom BCM8152CIFBG to view detailed technical specifications.
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