The BCM8705BIFBG is a 256-pin Ball Grid Array Ethernet PHY from Broadcom. It operates at a maximum data rate of 10.5188Gbps and supports the IEEE 802.3 standard. This device is designed for surface mount applications and features integrated CDR. It does not support overhead octet or PHY line side interface.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Number of Channels per Chip | 1 |
| Maximum Data Rate | 10.5188Gbps |
| PHY Line Side Interface | No |
| JTAG Support | Yes |
| Standard Supported | IEEE 802.3 |
| Typical Data Rate | 9953/10312.5/10518.8Mbps |
| Integrated CDR | Yes |
| Ethernet Speed | 10Gbps |
| Overhead Octet Support | No |
| Cage Code | 50434 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 5A991.b.1 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Broadcom BCM8705BIFBG to view detailed technical specifications.
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