The BCM8705LAKFB is a 256-pin fine pitch ball grid array (FBGA) Ethernet PHY from Broadcom. It operates at a maximum data rate of 10.5188Gbps and supports the IEEE 802.3 standard. The device is designed for surface mount applications and features JTAG support. It is a single-channel device with integrated clock data recovery (CDR) and is capable of 10Gbps Ethernet speeds.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Number of Channels per Chip | 1 |
| Maximum Data Rate | 10.5188Gbps |
| PHY Line Side Interface | No |
| JTAG Support | Yes |
| Standard Supported | IEEE 802.3 |
| Typical Data Rate | 9953/10312.5/10518.8Mbps |
| Integrated CDR | Yes |
| Ethernet Speed | 10Gbps |
| Overhead Octet Support | No |
| Cage Code | 50434 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Broadcom BCM8705LAKFB to view detailed technical specifications.
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