This BGA Telecom IC is a specialized integrated circuit with a package type of Ball Grid Array. It has a basic package type of Ball Grid Array and a package family name of BGA. The IC is mounted using the surface mount method and has a seated plane height of 2.33mm (max). The package material is plastic and the pin count is 388, with a pitch of 1.27mm. The IC is designed for use in telecommunications applications.
PackageBGA
MountingSurface Mount
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Technical Specifications
Broadcom CYNSE70128-066BGC technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 388 |
| PCB | 388 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.33(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 50434 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Broadcom CYNSE70128-066BGC Datasheet
Download the complete datasheet for Broadcom CYNSE70128-066BGC to view detailed technical specifications.
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