PackageBGA
MountingSurface Mount
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Technical Specifications
Broadcom CYNSE70128-66BGXIT technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
388
PCB
388
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
1.73
Seated Plane Height (mm)
2.33(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
50434
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Broadcom CYNSE70128-66BGXIT Datasheet
Download the complete datasheet for Broadcom CYNSE70128-66BGXIT to view detailed technical specifications.
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