The 6008 breadboard from Capital Advanced Technologies is a SIP (Single In-Line Package) component with 8 positions. It has a thickness of 0.79mm and is made from glass and epoxy materials. The board is lead free and has a width of 20.32mm and a height of 12.7mm. It belongs to the Surfboards series and is suitable for development and prototyping applications.
PackageSIP
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Technical Specifications
Capital Advanced Technologies 6008 technical specifications.
General
| Board Thickness | 0.79mm |
| Body Material | Glass, Epoxy |
| Package/Case | SIP |
| Height | 12.7mm |
| Lead Free | Lead Free |
| Material | Glass, Epoxy |
| Number of Positions | 8 |
| Series | 6000, Surfboards® |
| Thickness | 787um |
| Width | 20.32mm |
Compliance
| RoHS | Compliant |
Datasheet
Capital Advanced Technologies 6008 Datasheet
Download the complete datasheet for Capital Advanced Technologies 6008 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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