| Image | Part Number | Manufacturer | Description |
|---|---|---|---|
No Image | H35-175MP | Epoxy Technology | Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach |
No Image | H65-175MP | Epoxy Technology | Single Component, Alumina-Filled Epoxy For Military Hybrid Die and Component Attach |
No Image | E3001-HV | Epoxy Technology | Snap Cure, Single Component, Silver-Filled Die Attach Adhesive For Semiconductor Plastic Ic Packaging |
