Single-chip modem IC supporting 4.8kbps data rates. Features a 24-pin Thin Shrink Small Outline Package (TSSOP) with gull-wing leads for surface mounting. The lead-frame SMT package, measuring a maximum of 7.9mm x 4.5mm x 1.05mm with a 0.65mm pin pitch, conforms to JEDEC MO-153AD standards.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
CML CMX469AE2 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
7.9(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AD
Compliance
Cage Code
U0KK1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
RoHS Versions
2011/65/EU, 2015/863
Datasheet
CML CMX469AE2 Datasheet
Download the complete datasheet for CML CMX469AE2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.