Single-chip modem IC supporting 4.8kbps data rates. Features a 24-pin Thin Shrink Small Outline Package (TSSOP) with gull-wing leads for surface mounting. The lead-frame SMT package, measuring a maximum of 7.9mm x 4.5mm x 1.05mm with a 0.65mm pin pitch, conforms to JEDEC MO-153AD standards.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 7.9(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AD |
| Cage Code | U0KK1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| RoHS Versions | 2011/65/EU, 2015/863 |
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