Synchronous SRAM chip, 18M bit density, featuring a 1M x 18 configuration. Offers a maximum access time of 3.4 ns and a maximum clock rate of 167 MHz with SDR data rate architecture. This dual-port memory operates at 3.3V, housed in a 165-pin FBGA surface-mount package measuring 15mm x 13mm. Designed for a wide operating temperature range of -40°C to 85°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 165 |
| PCB | 165 |
| Package Length (mm) | 15 |
| Package Width (mm) | 13 |
| Package Height (mm) | 0.89 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 0.49956 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 18Mbit |
| Address Bus Width | 20bit |
| Maximum Access Time | 3.4ns |
| Timing Type | Synchronous |
| Maximum Clock Rate | 167MHz |
| Data Rate Architecture | SDR |
| Density in Bits | 18874368bit |
| Maximum Operating Current | 275mA |
| Typical Operating Supply Voltage | 3.3V |
| Number of Bits per Word | 18bit |
| Number of Ports | 2 |
| Number of Words | 1M |
| Min Operating Supply Voltage | 3.135V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Architecture | Pipelined |
| Cage Code | 65786 |
| EU RoHS | No |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.b |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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