Synchronous SRAM chip, 72M-bit density, organized as 2M words x 36 bits. Features a 21-bit address bus, 4 ports, and a maximum access time of 3 ns. Operates at a maximum clock rate of 200 MHz with SDR data rate architecture. Housed in a 165-pin FBGA package with a 17mm x 15mm footprint, designed for surface mounting. Typical operating supply voltage is 2.5V, with a range of 2.375V to 2.625V.
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Cypress CY7C1480BV25-200BZXCT technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 165 |
| PCB | 165 |
| Package Length (mm) | 17 |
| Package Width (mm) | 15 |
| Package Height (mm) | 0.89 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 72Mbit |
| Address Bus Width | 21bit |
| Maximum Access Time | 3ns |
| Timing Type | Synchronous |
| Maximum Clock Rate | 200MHz |
| Data Rate Architecture | SDR |
| Density in Bits | 75497472bit |
| Maximum Operating Current | 450mA |
| Typical Operating Supply Voltage | 2.5V |
| Number of Bits per Word | 36bit |
| Number of Ports | 4 |
| Number of Words | 2M |
| Min Operating Supply Voltage | 2.375V |
| Max Operating Supply Voltage | 2.625V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Architecture | Pipelined |
| Cage Code | 65786 |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A991.b.2.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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