DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Cypress CY7C1529AV18-200BZXI technical specifications.
| Max Operating Temperature | 85 |
| Number of Terminals | 165 |
| Min Operating Temperature | -40 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | R-PBGA-B165 |
| Width | 15 |
| Length | 17 |
| Pin Count | 165 |
| Number of Functions | 1 |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Nom (Vsup) | 1.8 |
| Supply Voltage-Max (Vsup) | 1.9 |
| Supply Voltage-Min (Vsup) | 1.7 |
| Supply Current-Max | 0.7 |
| Number of Words | 8388608 |
| Number of Words Code | 8000000 |
| Memory IC Type | DDR SRAM |
| Parallel/Serial | PARALLEL |
| Standby Current-Max | 0.36 |
| Access Time-Max | 0.45 |
| I/O Type | SEPARATE |
| RoHS | Yes |
| Eccn Code | 3A991.B.2.A |
| Lead Free | Yes |
| HTS Code | 8542.32.00.41 |
| REACH | Compliant |
| Military Spec | False |
No datasheet is available for this part.
