PackageDIP
MountingThrough Hole
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Technical Specifications
Cypress CY7C60223-PXC technical specifications.
General
Access Time
12us
Package/Case
DIP
Core Architecture
M8C
Interface
SPI
Lead Free
Lead Free
Max Operating Temperature
70°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
0°C
Mount
Through Hole
Number of I/Os
20
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, WDT, LVD
RoHS Compliant
Yes
Series
enCoRe™ II CY7C602xx
Compliance
RoHS
Compliant
Datasheet
Cypress CY7C60223-PXC Datasheet
Download the complete datasheet for Cypress CY7C60223-PXC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.