The CYV270M0101EQ-SXCES is a 16-pin SOIC packaged IC with a lead-frame SMT construction, suitable for surface mount applications. It has a maximum package length of 9.98mm, width of 3.99mm, and height of 1.48mm. The IC has a seated plane height of 1.73mm and a pin pitch of 1.27mm. It is made of plastic and is compliant with the Jedec MS-012AC standard.
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Cypress CYV270M0101EQ-SXCES technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 9.98(Max) |
| Package Width (mm) | 3.99(Max) |
| Package Height (mm) | 1.48(Max) |
| Seated Plane Height (mm) | 1.73(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AC |
| Cage Code | 65786 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Download the complete datasheet for Cypress CYV270M0101EQ-SXCES to view detailed technical specifications.
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