The MB9AF314MAPMC is a microcontroller packaged in an 80-pin LQFP lead-frame SMT package. It has a low profile quad flat package design with gull-wing leads and is suitable for surface mount applications. The package measures 12mm in length and width, and 1.4mm in height, with a seated plane height of 1.5mm and a pin pitch of 0.5mm. The package material is plastic and complies with the Jedec MS-026BDD standard.
PackageLQFP
MountingSurface Mount
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Technical Specifications
Cypress MB9AF314MAPMC technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 80 |
| PCB | 80 |
| Package Length (mm) | 12 |
| Package Width (mm) | 12 |
| Package Height (mm) | 1.4 |
| Seated Plane Height (mm) | 1.5 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BDD |
Compliance
| Cage Code | 65786 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Cypress MB9AF314MAPMC Datasheet
Download the complete datasheet for Cypress MB9AF314MAPMC to view detailed technical specifications.
No datasheet is available for this part.