16M-bit NOR Flash memory, featuring a parallel interface and 3.3V operation. This component offers 2M x 8 or 1M x 16 word configurations with a maximum access time of 120ns. The 48-pin Fine Pitch Ball Grid Array (FBGA) package is designed for surface mounting, with dimensions of 9mm x 8mm x 0.85mm and a 0.8mm pin pitch. It supports asynchronous timing, sectored architecture with a bottom boot block, and operates across a temperature range of -40°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress MBM29DL162BD-12PBT-E1 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 9 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 15mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|8.5 to 9.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 120ns |
| Number of Words | 2M/1M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 21/20bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 65786 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Cypress MBM29DL162BD-12PBT-E1 Datasheet
Download the complete datasheet for Cypress MBM29DL162BD-12PBT-E1 to view detailed technical specifications.
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