32M-bit NOR Flash memory with parallel interface, featuring 4M x 8 or 2M x 16 word organization and an 80ns maximum access time. This surface-mount component utilizes a 48-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 9mm x 6mm x 0.67mm. It operates with a typical supply voltage of 3V and supports programming voltages from 2.7V to 3.6V or 8.5V to 9.5V. The memory architecture is sectored with an asymmetrical block organization and includes a top boot block. Operating temperature range is -40°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Cypress MBM29DL320TF80PBT technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
48
PCB
48
Package Length (mm)
9
Package Width (mm)
6
Package Height (mm)
0.67
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel
Maximum Operating Current
18mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6|8.5 to 9.5V
Timing Type
Asynchronous
Maximum Access Time
80ns
Number of Words
4M/2M
Boot Block
Yes
Typical Operating Supply Voltage
3V
Address Bus Width
22/21bit
Location of Boot Block
Top
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
65786
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Cypress MBM29DL320TF80PBT Datasheet
Download the complete datasheet for Cypress MBM29DL320TF80PBT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.