64M-bit NOR Flash memory with parallel interface, featuring 8M x 8 or 4M x 16 word organization and a 60ns maximum access time. This surface-mount component utilizes a 48-pin FBGA package with a 0.8mm pin pitch, measuring 9mm x 8mm x 0.85mm. It operates from a typical 3V supply with a maximum operating current of 18mA, supporting programming voltages from 2.7 to 3.6V and 8.5 to 9.5V. The memory architecture is sectored and asymmetrical, with boot block capability located at the bottom or top, and an address bus width of 23/22 bits. Operating temperature range is -40°C to 85°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 9 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 18mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|8.5 to 9.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 60ns |
| Number of Words | 8M/4M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3V |
| Address Bus Width | 23/22bit |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 65786 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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