64M-bit NOR Flash memory with a parallel interface, offering 8M x 8 or 4M x 16 word configurations. Features a 70ns maximum access time and operates from a 3V supply. This component utilizes an asymmetrical, sectored architecture with boot blocks located at the bottom or top. Packaged in a 48-pin Fine Pitch Ball Grid Array (FBGA) with a 0.8mm pin pitch, it supports surface mounting and operates within a temperature range of -40°C to 85°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 9 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 18mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|8.5 to 9.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 8M/4M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3V |
| Address Bus Width | 23/22bit |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 65786 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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