512M-bit NOR Flash memory with Serial (SPI, Dual SPI, Quad SPI) interface. Features 3V/3.3V operation, 14.5ns maximum access time, and 24-pin BGA package. Supports 512M/256M/128M x 1/2/4-bit word configurations with symmetrical, sectored block organization and boot block capability at the bottom or top. Operates from -40°C to 105°C with a 2.7V to 3.6V programming voltage. Surface mountable 8mm x 6mm x 1.2mm BGA package.
PackageBGA
MountingSurface Mount
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Technical Specifications
Cypress S25FL512SAGBHVC13 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 8 |
| Package Width (mm) | 6 |
| Package Height (mm) | 1.2(Max) - 0.2(Min) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 512Mbit |
| Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
| Maximum Operating Current | 100mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6V |
| Timing Type | Synchronous |
| Maximum Access Time | 14.5ns |
| Number of Words | 512M/256M/128M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 32bit |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 1/2/4bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
Compliance
| Cage Code | 65786 |
| EU RoHS | Yes |
| HTS Code | 8542320051 |
| Schedule B | 8542320050 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Cypress S25FL512SAGBHVC13 Datasheet
Download the complete datasheet for Cypress S25FL512SAGBHVC13 to view detailed technical specifications.
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