The BU-64840R3-E02 is a specialized IC with a Ball Grid Array package, measuring 20.7mm in length and 20.7mm in width, with a seated plane height of 3.05mm. It features 324 pins with a 1mm pitch, and is made of plastic. This IC is designed for surface mount applications.
PackageBGA
MountingSurface Mount
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Technical Specifications
Data Device BU-64840R3-E02 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 20.7(Max) |
| Package Width (mm) | 20.7(Max) |
| Package Height (mm) | 3.05(Max) - 0.38 |
| Seated Plane Height (mm) | 3.05(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 0HYU1 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Data Device BU-64840R3-E02 Datasheet
Download the complete datasheet for Data Device BU-64840R3-E02 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.