The BU-64843B8-E02 is a Ball Grid Array IC from Data Device, featuring a 324-pin count and a maximum package size of 20.7mm in length and width, with a seated plane height of 3.05mm. It has a pin pitch of 1mm and is made of plastic. The IC is designed for surface mount applications.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 20.7(Max) |
| Package Width (mm) | 20.7(Max) |
| Package Height (mm) | 3.05(Max) - 0.38 |
| Seated Plane Height (mm) | 3.05(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 0HYU1 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Data Device BU-64843B8-E02 to view detailed technical specifications.
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