Quick Jump:
Technical Specifications
Data Device BU-64860B3-E02 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
20.7(Max)
Package Width (mm)
20.7(Max)
Package Height (mm)
3.05(Max) - 0.38
Seated Plane Height (mm)
3.05(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
0HYU1
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Data Device BU-64860B3-E02 Datasheet
Download the complete datasheet for Data Device BU-64860B3-E02 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.