The BU-65843B8-E02 is a Ball Grid Array IC with 324 pins, packaged in a 20.7mm x 20.7mm x 3.58mm plastic BGA. It is designed for surface mount applications and features a 1mm pin pitch. The IC is manufactured by Data Device and is categorized as an Interface IC.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 20.7(Max) |
| Package Width (mm) | 20.7(Max) |
| Package Height (mm) | 3.58(Max) |
| Seated Plane Height (mm) | 3.58(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 0HYU1 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Download the complete datasheet for Data Device BU-65843B8-E02 to view detailed technical specifications.
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