PM4351-RGI
Microchip
new molding compound material for PM4351-RGI catalog part number (CPN) available in 80L MQFP (14x14x2.0mm) package.
Product Change NoticeMicrochip
Microchip Qualification Report for PM4351-RGI PCN MAAN-23JRFM038
Reliability qualification report for PM4351-RGI using C194 lead-frame and G631HQ molding compound in an 80L LQFP package.
Overview
This qualification report summarizes the reliability testing for the Microchip PM4351-RGI device following the introduction of C194 lead-frame material and G631HQ molding compound. The components, assembled in an 80-lead LQFP (14x14x1.4mm) package at the ANAP site, were subjected to rigorous environmental and mechanical stress tests. Key evaluations included Moisture/Reflow Sensitivity (MSL3 at 260°C), High-Temperature Storage, Temperature Cycling, and Unbiased HAST. All tested units passed electrical and physical inspections according to IPC/JEDEC J-STD-020E and JESD22 standards, confirming the reliability of the new material set.
Use Cases
- Quality assurance compliance
- Material change verification
- Component sourcing assessment
- Reliability data review for PM4351 series
Topics
Microchip
PM4351-RGI
PM4351-LGI
PCN MAAN-23JRFM038
C194 lead-frame
G631HQ molding compound
80L LQFP
MSL3
Reliability Qualification
J-STD-020E
Referenced Parts
PM4351-LGI
Microchip
Part Number (CPN) PM4351-LGI
0.35um
Microchip
U0031 TSMC 0.35um in 80L LQFP 14x14x1.4mm package and assembled at ANAP pass
1-hr
Microchip
Test Condition / Criteria Pb-free 1-hr steam age. Dip at 245C. 100% leads >95% lead
14X14X1.4mm
Microchip
PKG width/size 14X14X1.4mm
14x14x1.4mm
Microchip
U0031 TSMC 0.35um in 80L LQFP 14x14x1.4mm package and assembled at ANAP pass
14x14x2.0mm
Microchip
(14x14x2.0mm) package.
14x14x2.0mm
Microchip
(CPN) available in 80L MQFP (14x14x2.0mm) package.
24-hour
Microchip
Test Condition MSL3: 150ºC 24-hour Bake 192 hour moisture soak at
245C.
Microchip
Test Condition / Criteria Pb-free 1-hr steam age. Dip at 245C. 100% leads >95% lead
25C
Microchip
Electrical Results at 25C (Fail /
331X331
Microchip
Paddle size 331X331 (8.4x8.4mm)
8.4x8.4mm
Microchip
Paddle size 331X331 (8.4x8.4mm)
80L
Microchip
RGI catalog part number (CPN) available in 80L MQFP
80L
Microchip
U0031 TSMC 0.35um in 80L LQFP 14x14x1.4mm package and assembled at ANAP pass
80L
Microchip
(CPN) available in 80L MQFP (14x14x2.0mm) package.
80X250mm
Microchip
Strip Size 80X250mm
B100
Microchip
Test Method JESD22 B100 and B108
B108
Microchip
Test Method JESD22 B100 and B108
BD-003501-01
Microchip
BD Number BD-003501-01
C194
Microchip
Material C194
C194
Microchip
Qualification of C194 as a new lead-frame material and
C194
Microchip
Qualification of C194 as a new lead-frame material and G631HQ as a
CDF-AEC-Q100-001
Microchip
Test Method Mil. Std. 883-2011 and CDF-AEC-Q100-001
D10I_UC.
Microchip
• Electrical test at D10I_UC.
G631HQ
Microchip
G631HQ as a new molding compound material for PM4351-
G631HQ
Microchip
Qualification of C194 as a new lead-frame material and G631HQ as a
G631HQ
Microchip
MC Part Number G631HQ
J-STD-002
Microchip
Test Method J-STD-002 / JESD22B-102
J-STD-020
Microchip
Test Method JESD22-A113; IPC/JEDEC J-STD-020
J-STD-020E
Microchip
IPC/JEDEC J-STD-020E standard.
JESD22
Microchip
Test Method JESD22 B100 and B108
JESD22-A103
Microchip
Test Method JESD22-A103
JESD22-A104
Microchip
Test Method JESD22-A104
JESD22-A113
Microchip
Test Method JESD22-A113; IPC/JEDEC J-STD-020
JESD22B-102
Microchip
Test Method J-STD-002 / JESD22B-102
MAAN-23JRFM038
Microchip
PCN#: MAAN-23JRFM038
MSL3
Microchip
Test Condition MSL3: 150ºC 24-hour Bake 192 hour moisture soak at
PM4351-
Microchip
G631HQ as a new molding compound material for PM4351-
U0031
Microchip
U0031 TSMC 0.35um in 80L LQFP 14x14x1.4mm package and assembled at ANAP pass
U00317X4XA01
Microchip
MP Code (MPC) U00317X4XA01
| PM4351-RGI | Microchip | new molding compound material for PM4351-RGI catalog part number (CPN) available in 80L MQFP (14x14x2.0mm) package. |
| PM4351-RGI | Microchip | new molding compound material for PM4351-RGI catalog part number |
| PM4351-LGI | Microchip | Part Number (CPN) PM4351-LGI |
| 0.35um | Microchip | U0031 TSMC 0.35um in 80L LQFP 14x14x1.4mm package and assembled at ANAP pass |
| 1-hr | Microchip | Test Condition / Criteria Pb-free 1-hr steam age. Dip at 245C. 100% leads >95% lead |
| 14X14X1.4mm | Microchip | PKG width/size 14X14X1.4mm |
| 14x14x1.4mm | Microchip | U0031 TSMC 0.35um in 80L LQFP 14x14x1.4mm package and assembled at ANAP pass |
| 14x14x2.0mm | Microchip | (14x14x2.0mm) package. |
| 14x14x2.0mm | Microchip | (CPN) available in 80L MQFP (14x14x2.0mm) package. |
| 24-hour | Microchip | Test Condition MSL3: 150ºC 24-hour Bake 192 hour moisture soak at |
| 245C. | Microchip | Test Condition / Criteria Pb-free 1-hr steam age. Dip at 245C. 100% leads >95% lead |
| 25C | Microchip | Electrical Results at 25C (Fail / |
| 331X331 | Microchip | Paddle size 331X331 (8.4x8.4mm) |
| 8.4x8.4mm | Microchip | Paddle size 331X331 (8.4x8.4mm) |
| 80L | Microchip | RGI catalog part number (CPN) available in 80L MQFP |
| 80L | Microchip | U0031 TSMC 0.35um in 80L LQFP 14x14x1.4mm package and assembled at ANAP pass |
| 80L | Microchip | (CPN) available in 80L MQFP (14x14x2.0mm) package. |
| 80X250mm | Microchip | Strip Size 80X250mm |
| B100 | Microchip | Test Method JESD22 B100 and B108 |
| B108 | Microchip | Test Method JESD22 B100 and B108 |
| BD-003501-01 | Microchip | BD Number BD-003501-01 |
| C194 | Microchip | Material C194 |
| C194 | Microchip | Qualification of C194 as a new lead-frame material and |
| C194 | Microchip | Qualification of C194 as a new lead-frame material and G631HQ as a |
| CDF-AEC-Q100-001 | Microchip | Test Method Mil. Std. 883-2011 and CDF-AEC-Q100-001 |
| D10I_UC. | Microchip | • Electrical test at D10I_UC. |
| G631HQ | Microchip | G631HQ as a new molding compound material for PM4351- |
| G631HQ | Microchip | Qualification of C194 as a new lead-frame material and G631HQ as a |
| G631HQ | Microchip | MC Part Number G631HQ |
| J-STD-002 | Microchip | Test Method J-STD-002 / JESD22B-102 |
| J-STD-020 | Microchip | Test Method JESD22-A113; IPC/JEDEC J-STD-020 |
| J-STD-020E | Microchip | IPC/JEDEC J-STD-020E standard. |
| JESD22 | Microchip | Test Method JESD22 B100 and B108 |
| JESD22-A103 | Microchip | Test Method JESD22-A103 |
| JESD22-A104 | Microchip | Test Method JESD22-A104 |
| JESD22-A113 | Microchip | Test Method JESD22-A113; IPC/JEDEC J-STD-020 |
| JESD22B-102 | Microchip | Test Method J-STD-002 / JESD22B-102 |
| MAAN-23JRFM038 | Microchip | PCN#: MAAN-23JRFM038 |
| MSL3 | Microchip | Test Condition MSL3: 150ºC 24-hour Bake 192 hour moisture soak at |
| PM4351- | Microchip | G631HQ as a new molding compound material for PM4351- |
| U0031 | Microchip | U0031 TSMC 0.35um in 80L LQFP 14x14x1.4mm package and assembled at ANAP pass |
| U00317X4XA01 | Microchip | MP Code (MPC) U00317X4XA01 |