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Product Change NoticeMicrochip

Qualification Plan Summary: Microchip DSPIC33FJ16GS502 Assembly at MMT

Microchip qualification plan for adding MMT as an assembly site for DSPIC33FJ16GS502-E/MX and DSPIC33FJ16GS502T-E/MX microcontrollers in 28L UQFN packages.

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Overview

This document details the qualification plan (PCN# CAAN-03OQBK734) for establishing MMT as an additional assembly site for Microchip DSPIC33FJ16GS502-E/MX and DSPIC33FJ16GS502T-E/MX parts. The assembly uses a 28L UQFN (6x6x0.5mm) package featuring CuPdAu bond wire, G700LTD mold compound, and EFTEC-64T lead frame material. The qualification testing follows AEC-Q100 Grade 1 standards, including High Temperature Storage Life (HTSL), HAST, and Temperature Cycling. The package is rated MSL-1 at 260°C reflow temperature.

Use Cases

  • Verifying secondary assembly source for DSPIC33FJ16GS502 microcontrollers
  • Reviewing automotive-grade reliability qualification data
  • Checking material composition for 28L UQFN 6x6x0.5mm packages
  • Supplier quality management and supply chain risk mitigation

Topics

Microchip
DSPIC33FJ16GS502-E/MX
PCN
UQFN
AEC-Q100
MMT
CuPdAu
Semiconductor Assembly
Reliability Testing
MSL-1

Referenced Parts

DSPIC33FJ16GS502-E/MX

Microchip

Qualification of MMT as an additional assembly site for DSPIC33FJ16GS502-E/MX and DSPIC33FJ16GS502T-E/MX catalog part numbers (CPN)

DSPIC33FJ16GS502T-E/MX

Microchip

Qualification of MMT as an additional assembly site for DSPIC33FJ16GS502-E/MX and DSPIC33FJ16GS502T-E/MX catalog part numbers (CPN)

DSPIC33FJ16GS502-E/MX

Microchip

Purpose: Qualification of MMT as an additional assembly site for DSPIC33FJ16GS502-E/MX and

DSPIC33FJ16GS502T-E/MX

Microchip

DSPIC33FJ16GS502T-E/MX catalog part numbers (CPN) available in 28L UQFN (6x6x0.5mm)

173x173

Microchip

Paddle size 173x173

1st

Microchip

1st Readpoint:

250x70mm

Microchip

Strip Size 250x70mm

28L

Microchip

DSPIC33FJ16GS502T-E/MX catalog part numbers (CPN) available in 28L UQFN (6x6x0.5mm)

28L

Microchip

part numbers (CPN) available in 28L UQFN (6x6x0.5mm) package.

6x6x0.5mm

Microchip

part numbers (CPN) available in 28L UQFN (6x6x0.5mm) package.

6x6x0.5mm

Microchip

PKG width/size 6x6x0.5mm

6x6x0.5mm

Microchip

DSPIC33FJ16GS502T-E/MX catalog part numbers (CPN) available in 28L UQFN (6x6x0.5mm)

8006NS

Microchip

Part Number 8006NS (PFAS free)

A101

Microchip

uHAST JESD22-A102, A118, or A101

A110

Microchip

HAST JESD22-A101 or A110

A118

Microchip

uHAST JESD22-A102, A118, or A101

AEC-Q006.

Microchip

Grade 1: +25°C, +85°C, +125°C 77 5 3 246 0 10 - 22 MTAI MTAI Perform per the requirements in AEC-Q006.

AEC-Q006.

Microchip

Grade 1: +25°C,+85°C, +125°C 77 5 3 246 0 15 - 120 MTAI MTAI Perform per the requirements in AEC-Q006.

AEC-Q100/Q101.

Microchip

Grade 1: +25°C, +85°C, +125°C 45 5 3 150 0 21 - 167 MTAI MTAI Perform per the requirements in AEC-Q100/Q101.

BD-004153-01

Microchip

BD Number BD-004153-01

CAAN-03OQBK734

Microchip

PCN#: CAAN-03OQBK734

CDF-AEC-Q100-001

Microchip

CDF-AEC-Q100-001 5 0 1 5 0 5 30 bonds from a min. 5 devices.

EFTEC-64T

Microchip

Material EFTEC-64T

G700LTD

Microchip

MC Part Number G700LTD

J-STD-002D

Microchip

J-STD-002D ; Perform 8 hours of steam aging for Matte tin finish and 1 hour steam aging for NiPdAu finish prior to testing.

JESD22-A101

Microchip

HAST JESD22-A101 or A110

JESD22-A102

Microchip

uHAST JESD22-A102, A118, or A101

JESD22-A104

Microchip

Temp Cycle JESD22-A104 and Appendix 3

MSL-1

Microchip

MSL-1 @260 °C

STD-020E

Microchip

STD-020E for package type.

YGAR14MQXDBF

Microchip

MP Code (MPC) YGAR14MQXDBF

Qualification Plan Summary: Microchip DSPIC33FJ16GS502 Assembly at MMT | Design Resources