ATAES132A-MAHEQ-S
Microchip
The ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and ATAES132A-MAHER-T catalog part numbers (CPN)
Product Change NoticeMicrochip
Qualification Report for Additional Assembly Site (MMT) - 8L UDFN Package for ATSHA and ATECC Security Devices
Reliability report qualifying Microchip Technology Thailand (MMT) as an additional assembly site for ATSHA and ATECC security devices in 8L UDFN packages.
Overview
This qualification report (PCN CENO-27KHGL858) documents the approval of Microchip Technology Thailand (MMT) as an additional assembly site for several security device families, including ATSHA204A, ATECC108A, ATECC508A, ATECC608A, and ATECC608B. The report focuses on the 8L UDFN (2x3x0.6mm) package using CuPdAu bond wire and G700LTD mold compound. Reliability testing confirmed a Moisture Sensitivity Level (MSL) 1 rating at 260°C. Further evaluations included temperature cycling (-65°C to +150°C), biased and unbiased HAST, high-temperature storage life, and solderability, all of which met standard JESD22 and IPC/JEDEC requirements. ATAES132A variants were qualified by similarity (QBS).
Use Cases
- Supply chain management for ATSHA and ATECC security ICs
- Verifying assembly site qualification for industrial and commercial designs
- Confirming MSL ratings and reflow temperature compliance for 8L UDFN packages
- Documenting material composition and reliability standards for security hardware
Topics
Microchip
ATSHA204A
ATECC108A
ATECC508A
ATECC608A
ATECC608B
ATAES132A
8L UDFN
MMT
qualification report
reliability testing
MSL 1
Referenced Parts
ATAES132A-MAHEQ-T
Microchip
The ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and ATAES132A-MAHER-T catalog part numbers (CPN)
ATAES132A-MAHER-S
Microchip
The ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and ATAES132A-MAHER-T catalog part numbers (CPN)
ATAES132A-MAHER-T
Microchip
The ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and ATAES132A-MAHER-T catalog part numbers (CPN)
ATECC108A
Microchip
Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families
ATECC508A
Microchip
Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families
ATECC608A
Microchip
Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families
ATECC608B
Microchip
Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families
ATECC608B-MAHDA-S
Microchip
Part No. ATECC608B-MAHDA-S
ATSHA204A
Microchip
Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families
2114RW7
Microchip
MMT-220201533.000 U8CD921455061.100 2114RW7
2114THD
Microchip
MMT-220201994.000 U8CD921455061.100 2114THD
2114TJ2
Microchip
MMT-220201995.000 U8CD921455061.100 2114TJ2
2200D
Microchip
System: ERSA RA 2200D
2x3x0.6
Microchip
8L UDFN (2x3x0.6 mm) assembled by MMT pass reliability test per QCI-
2x3x0.6mm
Microchip
UDFN (2x3x0.6mm) package. The ATAES132A-MAHEQ-S,
2x3x0.6mm
Microchip
in 8L UDFN (2x3x0.6mm) package will qualify by similarity
2x3x0.6mm
Microchip
8L UDFN (2x3x0.6mm) package will qualify by similarity (QBS).
2x3x0.6mm
Microchip
device families available in 8L UDFN (2x3x0.6mm) package. The
58962TQ4BSDA
Microchip
MP CODE 58962TQ4BSDA
6000X
Microchip
System: HAST 6000X
64T
Microchip
Material EFTEC 64T
95.5Ag3.9
Microchip
Solder material:Pb Free Sn 95.5Ag3.9 Cu0.6
A118
Microchip
A118 pre-conditioned
ATAES132A-MAHEQ-
Microchip
ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ-
ATECC108A
Microchip
selected ATSHA204A, ATECC108A, ATECC508A,
ATECC108A
Microchip
ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B
ATECC508A
Microchip
ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B
ATECC508A
Microchip
selected ATSHA204A, ATECC108A, ATECC508A,
ATECC608A
Microchip
ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B
ATECC608A
Microchip
ATECC608A and ATECC608B device families available in 8L
ATECC608B
Microchip
ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B
ATECC608B
Microchip
ATECC608A and ATECC608B device families available in 8L
ATSHA204A
Microchip
ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B
ATSHA204A
Microchip
selected ATSHA204A, ATECC108A, ATECC508A,
BDE-006701
Microchip
Bonding No. BDE-006701 Rev. 02
CENO-27KHGL858
Microchip
PCN #: CENO-27KHGL858
Cu0.6
Microchip
Solder material:Pb Free Sn 95.5Ag3.9 Cu0.6
ES355986
Microchip
CN ES355986
G700LTD
Microchip
Mold Compound G700LTD
J-STD-002
Microchip
J-STD-002 22 (0) 22
J-STD-020E
Microchip
Level 1 at 260°C reflow temperature per IPC/JEDEC J-STD-020E standard.
JESD22-
Microchip
Stress Condition: JESD22- 231 Parts had been
JESD22-
Microchip
Precondition Electrical Test: +25°C and 85°C JESD22- 693(0) 693 Good
JESD22A103
Microchip
Stress Condition: JESD22A103 45 45 units
MMT-220201533.000
Microchip
MMT-220201533.000 U8CD921455061.100 2114RW7
MMT-220201994.000
Microchip
MMT-220201994.000 U8CD921455061.100 2114THD
MMT-220201995.000
Microchip
MMT-220201995.000 U8CD921455061.100 2114TJ2
MR1243
Microchip
System: Vitronics Soltec MR1243
PR-3SPH
Microchip
System: TABAI ESPEC Model PR-3SPH
Pb37
Microchip
Solder material: SnPb Sn63, Pb37
R2100429
Microchip
QUAL ID R2100429 Rev A
SAS-3000
Microchip
System: SAS-3000
Sn63
Microchip
Solder material: SnPb Sn63, Pb37
TSA-70H
Microchip
System: TABAI ESPEC TSA-70H
U8CD921455061.100
Microchip
MMT-220201994.000 U8CD921455061.100 2114THD
U8CD921455061.100
Microchip
MMT-220201533.000 U8CD921455061.100 2114RW7
U8CD921455061.100
Microchip
MMT-220201995.000 U8CD921455061.100 2114TJ2
| ATAES132A-MAHEQ-S | Microchip | The ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and ATAES132A-MAHER-T catalog part numbers (CPN) |
| ATAES132A-MAHEQ-T | Microchip | The ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and ATAES132A-MAHER-T catalog part numbers (CPN) |
| ATAES132A-MAHER-S | Microchip | The ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and ATAES132A-MAHER-T catalog part numbers (CPN) |
| ATAES132A-MAHER-T | Microchip | The ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and ATAES132A-MAHER-T catalog part numbers (CPN) |
| ATAES132A-MAHEQ-S | Microchip | ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ- |
| ATAES132A-MAHEQ-S | Microchip | UDFN (2x3x0.6mm) package. The ATAES132A-MAHEQ-S, |
| ATAES132A-MAHEQ-T | Microchip | ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and |
| ATAES132A-MAHER-S | Microchip | ATAES132A-MAHER-S, ATAES132A-MAHEQ-T and |
| ATAES132A-MAHER-S | Microchip | ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ- |
| ATAES132A-MAHER-T | Microchip | ATAES132A-MAHER-T catalog part numbers (CPN) available |
| ATAES132A-MAHER-T | Microchip | T and ATAES132A-MAHER-T catalog part numbers (CPN) available in |
| ATECC108A | Microchip | Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families |
| ATECC508A | Microchip | Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families |
| ATECC608A | Microchip | Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families |
| ATECC608B | Microchip | Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families |
| ATECC608B-MAHDA-S | Microchip | Part No. ATECC608B-MAHDA-S |
| ATSHA204A | Microchip | Qualification of MMT as an additional assembly site for selected ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B device families |
| 2114RW7 | Microchip | MMT-220201533.000 U8CD921455061.100 2114RW7 |
| 2114THD | Microchip | MMT-220201994.000 U8CD921455061.100 2114THD |
| 2114TJ2 | Microchip | MMT-220201995.000 U8CD921455061.100 2114TJ2 |
| 2200D | Microchip | System: ERSA RA 2200D |
| 2x3x0.6 | Microchip | 8L UDFN (2x3x0.6 mm) assembled by MMT pass reliability test per QCI- |
| 2x3x0.6mm | Microchip | UDFN (2x3x0.6mm) package. The ATAES132A-MAHEQ-S, |
| 2x3x0.6mm | Microchip | in 8L UDFN (2x3x0.6mm) package will qualify by similarity |
| 2x3x0.6mm | Microchip | 8L UDFN (2x3x0.6mm) package will qualify by similarity (QBS). |
| 2x3x0.6mm | Microchip | device families available in 8L UDFN (2x3x0.6mm) package. The |
| 58962TQ4BSDA | Microchip | MP CODE 58962TQ4BSDA |
| 6000X | Microchip | System: HAST 6000X |
| 64T | Microchip | Material EFTEC 64T |
| 95.5Ag3.9 | Microchip | Solder material:Pb Free Sn 95.5Ag3.9 Cu0.6 |
| A118 | Microchip | A118 pre-conditioned |
| ATAES132A-MAHEQ- | Microchip | ATAES132A-MAHEQ-S, ATAES132A-MAHER-S, ATAES132A-MAHEQ- |
| ATECC108A | Microchip | selected ATSHA204A, ATECC108A, ATECC508A, |
| ATECC108A | Microchip | ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B |
| ATECC508A | Microchip | ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B |
| ATECC508A | Microchip | selected ATSHA204A, ATECC108A, ATECC508A, |
| ATECC608A | Microchip | ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B |
| ATECC608A | Microchip | ATECC608A and ATECC608B device families available in 8L |
| ATECC608B | Microchip | ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B |
| ATECC608B | Microchip | ATECC608A and ATECC608B device families available in 8L |
| ATSHA204A | Microchip | ATSHA204A, ATECC108A, ATECC508A, ATECC608A and ATECC608B |
| ATSHA204A | Microchip | selected ATSHA204A, ATECC108A, ATECC508A, |
| BDE-006701 | Microchip | Bonding No. BDE-006701 Rev. 02 |
| CENO-27KHGL858 | Microchip | PCN #: CENO-27KHGL858 |
| Cu0.6 | Microchip | Solder material:Pb Free Sn 95.5Ag3.9 Cu0.6 |
| ES355986 | Microchip | CN ES355986 |
| G700LTD | Microchip | Mold Compound G700LTD |
| J-STD-002 | Microchip | J-STD-002 22 (0) 22 |
| J-STD-020E | Microchip | Level 1 at 260°C reflow temperature per IPC/JEDEC J-STD-020E standard. |
| JESD22- | Microchip | Stress Condition: JESD22- 231 Parts had been |
| JESD22- | Microchip | Precondition Electrical Test: +25°C and 85°C JESD22- 693(0) 693 Good |
| JESD22A103 | Microchip | Stress Condition: JESD22A103 45 45 units |
| MMT-220201533.000 | Microchip | MMT-220201533.000 U8CD921455061.100 2114RW7 |
| MMT-220201994.000 | Microchip | MMT-220201994.000 U8CD921455061.100 2114THD |
| MMT-220201995.000 | Microchip | MMT-220201995.000 U8CD921455061.100 2114TJ2 |
| MR1243 | Microchip | System: Vitronics Soltec MR1243 |
| PR-3SPH | Microchip | System: TABAI ESPEC Model PR-3SPH |
| Pb37 | Microchip | Solder material: SnPb Sn63, Pb37 |
| R2100429 | Microchip | QUAL ID R2100429 Rev A |
| SAS-3000 | Microchip | System: SAS-3000 |
| Sn63 | Microchip | Solder material: SnPb Sn63, Pb37 |
| TSA-70H | Microchip | System: TABAI ESPEC TSA-70H |
| U8CD921455061.100 | Microchip | MMT-220201994.000 U8CD921455061.100 2114THD |
| U8CD921455061.100 | Microchip | MMT-220201533.000 U8CD921455061.100 2114RW7 |
| U8CD921455061.100 | Microchip | MMT-220201995.000 U8CD921455061.100 2114TJ2 |