Qualification Report for Microchip EEPROMs in 8L TSSOP (ASSH and ANAP Assembly Sites)
Qualification report for ASSH/ANAP assembly sites, CuPdAu wire, and AMK materials for Microchip AT25080B, AT25160B, AT24C256C, and 25CS640 EEPROMs in 8L TSSOP packages.
Overview
This qualification report (PCN BLAS-09GOSU780) details the approval of ASSH as an additional assembly site and the implementation of palladium-coated copper with gold flash (CuPdAu) as a new wire material for Microchip EEPROMs. It also qualifies AMK-EP27 die attach and AMK-MC27 mold compound materials at the ANAP assembly site for devices in 8L TSSOP (4.4mm) packages. Reliability testing including Moisture/Reflow Sensitivity (MSL 1), Temperature Cycling, HAST, and High-Temperature Storage Life was successfully completed for part numbers including AT25080B, AT25160B, AT24C256C, and 25CS640.
Use Cases
- Supply chain verification
- Quality assurance documentation
- Material change assessment
- Manufacturing site compliance
Topics
Referenced Parts
Microchip
AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers (CPN)
Microchip
AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers (CPN)
Microchip
AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers (CPN)
Microchip
AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers (CPN)
Microchip
AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part
Microchip
AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part
Microchip
AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part
Microchip
AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part
25CS640T-E/ST
Microchip
Part No. 25CS640T-E/ST
1752USC
Microchip
ASSH184000082.000 MCSO518384144.000 1752USC
20057CC
Microchip
ASSH204400040.000 MCSO520177622.000 20057CC
2008CDJ
Microchip
ASSH204700076.000 MCSO520167575.000 2008CDJ
2200D
Microchip
System: ERSA RA 2200D
3583079CXC03
Microchip
MP CODE 3583079CXC03
4.4mm
Microchip
(CPN) available in 8L TSSOP (4.4mm) package will qualify by
4.4mm
Microchip
numbers (CPN) available in 8L TSSOP (4.4mm) package will qualify by similarity (QBS).
6000X
Microchip
System: HAST 6000X
95.5Ag3.9
Microchip
Solder material:Pb Free Sn 95.5Ag3.9 Cu0.6
AMK-EP27
Microchip
(CuPdAu) as a new wire material, AMK-EP27 as a new die attach
AMK-EP27
Microchip
copper with gold flash (CuPdAu) as a new wire material, AMK-EP27 as a new die attach
AMK-MC27
Microchip
material and AMK-MC27 as a new mold compound material at ANAP assembly site for
AMK-MC27
Microchip
material and AMK-MC27 as a new mold compound material at
ASSH184000082.000
Microchip
ASSH184000082.000 MCSO518384144.000 1752USC
ASSH204400040.000
Microchip
ASSH204400040.000 MCSO520177622.000 20057CC
ASSH204700076.000
Microchip
ASSH204700076.000 MCSO520167575.000 2008CDJ
BLAS-09GOSU780
Microchip
PCN #: BLAS-09GOSU780
C7025
Microchip
Material C7025
Cu0.6
Microchip
Solder material:Pb Free Sn 95.5Ag3.9 Cu0.6
DC-166-F-ST350
Microchip
System: TPS DC-166-F-ST350
EN-4900GC
Microchip
Epoxy EN-4900GC
ES345370
Microchip
CN ES345370
G700LY
Microchip
Mold Compound G700LY
J-STD-020E
Microchip
IPC/JEDEC J-STD-020E standard.
J-STD-020E
Microchip
(IPC/JEDEC J-STD-020E)
LI-WMA400008-05-00
Microchip
Part Number LI-WMA400008-05-00
MCSO518384144.000
Microchip
ASSH184000082.000 MCSO518384144.000 1752USC
MCSO520167575.000
Microchip
ASSH204700076.000 MCSO520167575.000 2008CDJ
MCSO520177622.000
Microchip
ASSH204400040.000 MCSO520177622.000 20057CC
MR1243
Microchip
System: Vitronics Soltec MR1243
PR-3SPH
Microchip
System: TABAI ESPEC Model PR-3SPH
Pb37
Microchip
Solder material: SnPb Sn63, Pb37
QCI-39000.This
Microchip
8L TSSOP assembled by ASSH pass reliability test per QCI-39000.This package was
R2000526
Microchip
QUAL ID R2000526 Rev. C
SAS-3000
Microchip
System: SAS-3000
Sn63
Microchip
Solder material: SnPb Sn63, Pb37
TSA-70H
Microchip
System: TABAI ESPEC TSA-70H
W35830ayu
Microchip
Bonding No. W35830ayu
| AT24C256C-XHL-B | Microchip | Part No. AT24C256C-XHL-B |
| AT25080B-XHL-B | Microchip | AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers (CPN) |
| AT25080B-XHL-T | Microchip | AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers (CPN) |
| AT25160B-XHL-B | Microchip | AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers (CPN) |
| AT25160B-XHL-T | Microchip | AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers (CPN) |
| AT25080B-XHL-B | Microchip | AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part |
| AT25080B-XHL-B | Microchip | ANAP assembly site for AT25080B-XHL-B, AT25080B-XHL-T, |
| AT25080B-XHL-T | Microchip | ANAP assembly site for AT25080B-XHL-B, AT25080B-XHL-T, |
| AT25080B-XHL-T | Microchip | AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part |
| AT25160B-XHL-B | Microchip | AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers |
| AT25160B-XHL-B | Microchip | AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part |
| AT25160B-XHL-T | Microchip | AT25160B-XHL-T and AT25160B-XHL-B catalog part numbers |
| AT25160B-XHL-T | Microchip | AT25080B-XHL-B, AT25080B-XHL-T, AT25160B-XHL-T and AT25160B-XHL-B catalog part |
| 25CS640T-E/ST | Microchip | Part No. 25CS640T-E/ST |
| 1752USC | Microchip | ASSH184000082.000 MCSO518384144.000 1752USC |
| 20057CC | Microchip | ASSH204400040.000 MCSO520177622.000 20057CC |
| 2008CDJ | Microchip | ASSH204700076.000 MCSO520167575.000 2008CDJ |
| 2200D | Microchip | System: ERSA RA 2200D |
| 3583079CXC03 | Microchip | MP CODE 3583079CXC03 |
| 4.4mm | Microchip | (CPN) available in 8L TSSOP (4.4mm) package will qualify by |
| 4.4mm | Microchip | numbers (CPN) available in 8L TSSOP (4.4mm) package will qualify by similarity (QBS). |
| 6000X | Microchip | System: HAST 6000X |
| 95.5Ag3.9 | Microchip | Solder material:Pb Free Sn 95.5Ag3.9 Cu0.6 |
| AMK-EP27 | Microchip | (CuPdAu) as a new wire material, AMK-EP27 as a new die attach |
| AMK-EP27 | Microchip | copper with gold flash (CuPdAu) as a new wire material, AMK-EP27 as a new die attach |
| AMK-MC27 | Microchip | material and AMK-MC27 as a new mold compound material at ANAP assembly site for |
| AMK-MC27 | Microchip | material and AMK-MC27 as a new mold compound material at |
| ASSH184000082.000 | Microchip | ASSH184000082.000 MCSO518384144.000 1752USC |
| ASSH204400040.000 | Microchip | ASSH204400040.000 MCSO520177622.000 20057CC |
| ASSH204700076.000 | Microchip | ASSH204700076.000 MCSO520167575.000 2008CDJ |
| BLAS-09GOSU780 | Microchip | PCN #: BLAS-09GOSU780 |
| C7025 | Microchip | Material C7025 |
| Cu0.6 | Microchip | Solder material:Pb Free Sn 95.5Ag3.9 Cu0.6 |
| DC-166-F-ST350 | Microchip | System: TPS DC-166-F-ST350 |
| EN-4900GC | Microchip | Epoxy EN-4900GC |
| ES345370 | Microchip | CN ES345370 |
| G700LY | Microchip | Mold Compound G700LY |
| J-STD-020E | Microchip | IPC/JEDEC J-STD-020E standard. |
| J-STD-020E | Microchip | (IPC/JEDEC J-STD-020E) |
| LI-WMA400008-05-00 | Microchip | Part Number LI-WMA400008-05-00 |
| MCSO518384144.000 | Microchip | ASSH184000082.000 MCSO518384144.000 1752USC |
| MCSO520167575.000 | Microchip | ASSH204700076.000 MCSO520167575.000 2008CDJ |
| MCSO520177622.000 | Microchip | ASSH204400040.000 MCSO520177622.000 20057CC |
| MR1243 | Microchip | System: Vitronics Soltec MR1243 |
| PR-3SPH | Microchip | System: TABAI ESPEC Model PR-3SPH |
| Pb37 | Microchip | Solder material: SnPb Sn63, Pb37 |
| QCI-39000.This | Microchip | 8L TSSOP assembled by ASSH pass reliability test per QCI-39000.This package was |
| R2000526 | Microchip | QUAL ID R2000526 Rev. C |
| SAS-3000 | Microchip | System: SAS-3000 |
| Sn63 | Microchip | Solder material: SnPb Sn63, Pb37 |
| TSA-70H | Microchip | System: TABAI ESPEC TSA-70H |
| W35830ayu | Microchip | Bonding No. W35830ayu |