MD1210K6-G
Microchip
Device MD1210K6-G (mask 69001) in 12-lead VQFN 4x4mm (UHX) with 1.0 mil Au wire assembled at ASEM is selected as the qualification vehicle.
Product Change NoticeMicrochip
Qualification Report for Microchip Fab 5 (MCSO) Fabrication Location (MD1711, MD1211, MD1210, MD1213, MD1811, MD1810)
Qualification report for Microchip's Fab 5 (Colorado) as a new fabrication site for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families.
Overview
This document outlines the qualification of Microchip Technology’s Colorado – Fab 5 (MCSO) as a new fabrication location for the MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families using 69K technology. The qualification utilized the MD1210K6-G in a 12-lead VQFN 4x4mm package as the primary test vehicle. Reliability testing included High Temperature Operating Life (HTOL), ESD Human Body Model (HBM), Latch Up, MSL1 preconditioning, Highly Accelerated Stress Test (HAST), Unbiased HAST, Temperature Cycling, and High Temperature Storage Life (HTSL). All test results passed the standards established in Microchip specification QCI-39000.
Use Cases
- Supply chain risk assessment
- Quality assurance documentation
- Component sourcing validation
- Manufacturing transition tracking
Topics
Microchip
MD1711
MD1211
MD1210
MD1213
MD1811
MD1810
MD1210K6-G
Fab 5
MCSO
Qualification Report
PCN ALAN-01IZZC624
Referenced Parts
MD1210K6-G
Microchip
Reliability stress results on test device MD1210K6-G indicate no assembly-related quality problem
MD1210K6-G
Microchip
MD1210K6-G (mask 69001) in 12-lead VQFN 4x4mm (UHX) with 1.0 mil Au wire assembled at ASEM
1000HRS
Microchip
HTOL 1000HRS at
12-lead
Microchip
MD1210K6-G (mask 69001) in 12-lead VQFN 4x4mm (UHX) with 1.0 mil Au wire assembled at ASEM
12-lead
Microchip
PACKAGE 12-lead VQFN 4x4mm
12L
Microchip
Pin/Ball Count 12L
12V
Microchip
Test Method/Condition JESD22-A110, Ta = +130oC/85%RH, 96 hrs. Vdd = 12V
170012145201UHD
Microchip
Part Number 170012145201UHD
258x78
Microchip
Strip Size 258x78 mm
260oC
Microchip
+85oC/85%RH/168hrs, 3x at 260oC peak Reflow Temperature
4x4
Microchip
PKG width/size 4x4
4x4mm
Microchip
PACKAGE 12-lead VQFN 4x4mm
4x4mm
Microchip
MD1210K6-G (mask 69001) in 12-lead VQFN 4x4mm (UHX) with 1.0 mil Au wire assembled at ASEM
69001QUHXA00
Microchip
MP Code (MPC) 69001QUHXA00
69K
Microchip
MD1811, and MD1810 device families of 69K technology available in
69K
Microchip
families of 69K technology available in various packages will qualify by similarity
69K
Microchip
MD1810 device families of 69K technology available in various packages.
855/strip
Microchip
Strip Density 855/strip
96hrs.
Microchip
Test Method/Condition JESD22-A118, Ta = +130oC/85%RH, 96hrs.
A-077959
Microchip
BD Number A-077959 rev A
ALAN-01IZZC624
Microchip
PCN#: ALAN-01IZZC624
ASEM262400048.000
Microchip
ASSEMBLY LOT ASEM262400048.000
ASEM262400048.000
Microchip
ASEM262400048.000 Passed
C194
Microchip
Material C194
G770HCD
Microchip
MC Part Number G770HCD
J-STD-020
Microchip
Test Method/Condition JEDEC J-STD-020 and JESD22-A113, MSL Level 1 soak at
JESD22-A103
Microchip
Test Method/Condition JESD22-A103, Ta = +150 oC, 1000 hrs
JESD22-A104
Microchip
Test Method/Condition JESD22-A104, Ta = -65oC/+150 oC, 500 cycles.
JESD22-A110
Microchip
Test Method/Condition JESD22-A110, Ta = +130oC/85%RH, 96 hrs. Vdd = 12V
JESD22-A113
Microchip
Test Method/Condition JEDEC J-STD-020 and JESD22-A113, MSL Level 1 soak at
JESD22-A118
Microchip
Test Method/Condition JESD22-A118, Ta = +130oC/85%RH, 96hrs.
MCSO526058486.100/5B0286
Microchip
WAFER LOT MCSO526058486.100/5B0286
MD1210
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213,
MD1210
Microchip
fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and
MD1210
Microchip
location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device
MD1211
Microchip
location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device
MD1211
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213,
MD1211
Microchip
fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and
MD1213
Microchip
fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and
MD1213
Microchip
location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device
MD1213
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213,
MD1711
Microchip
fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and
MD1711
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213,
MD1711
Microchip
location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device
MD1810
Microchip
location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device
MD1810
Microchip
MD1811, and MD1810 device families of 69K technology available in
MD1810
Microchip
MD1810 device families of 69K technology available in various packages.
MD1811
Microchip
location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device
MD1811
Microchip
fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and
MD1811
Microchip
MD1811, and MD1810 device families of 69K technology available in
ML0220263984
Microchip
Document Control Number ML0220263984
MSL-1
Microchip
MSL information MSL-1
MSL1
Microchip
c. Unbiased HAST post MSL1 Preconditioning.
MSL1
Microchip
a. Package Preconditioning MSL1
MSL1
Microchip
b. HAST Post MSL1 Preconditioning.
MSL1
Microchip
QUAL TESTS HTSL, MSL1, HAST, UHAST, TC
MSL1
Microchip
d. Temperature Cycling post MSL1 Preconditioning
QCI-39000
Microchip
QCI-39000, “Worldwide Quality Conformance Requirements.
QMI519
Microchip
Die Attach Part Number QMI519
VM1C
Microchip
qualification of VM1C process fabricated at Fab 5 (Colorado Spring), following guidelines established
VM1C
Microchip
with VM1C material fabricated at Fab 5 as per guidelines established in Microchip specification
MD1210
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families
MD1211
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families
MD1213
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families
MD1711
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families
MD1810
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families
MD1811
Microchip
new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families
| MD1210K6-G | Microchip | Device MD1210K6-G (mask 69001) in 12-lead VQFN 4x4mm (UHX) with 1.0 mil Au wire assembled at ASEM is selected as the qualification vehicle. |
| MD1210K6-G | Microchip | Reliability stress results on test device MD1210K6-G indicate no assembly-related quality problem |
| MD1210K6-G | Microchip | Device MD1210K6-G |
| MD1210K6-G | Microchip | MD1210K6-G (mask 69001) in 12-lead VQFN 4x4mm (UHX) with 1.0 mil Au wire assembled at ASEM |
| MD1210K6-G | Microchip | Part Number (CPN) MD1210K6-G |
| 1000HRS | Microchip | HTOL 1000HRS at |
| 12-lead | Microchip | MD1210K6-G (mask 69001) in 12-lead VQFN 4x4mm (UHX) with 1.0 mil Au wire assembled at ASEM |
| 12-lead | Microchip | PACKAGE 12-lead VQFN 4x4mm |
| 12L | Microchip | Pin/Ball Count 12L |
| 12V | Microchip | Test Method/Condition JESD22-A110, Ta = +130oC/85%RH, 96 hrs. Vdd = 12V |
| 170012145201UHD | Microchip | Part Number 170012145201UHD |
| 258x78 | Microchip | Strip Size 258x78 mm |
| 260oC | Microchip | +85oC/85%RH/168hrs, 3x at 260oC peak Reflow Temperature |
| 4x4 | Microchip | PKG width/size 4x4 |
| 4x4mm | Microchip | PACKAGE 12-lead VQFN 4x4mm |
| 4x4mm | Microchip | MD1210K6-G (mask 69001) in 12-lead VQFN 4x4mm (UHX) with 1.0 mil Au wire assembled at ASEM |
| 69001QUHXA00 | Microchip | MP Code (MPC) 69001QUHXA00 |
| 69K | Microchip | MD1811, and MD1810 device families of 69K technology available in |
| 69K | Microchip | families of 69K technology available in various packages will qualify by similarity |
| 69K | Microchip | MD1810 device families of 69K technology available in various packages. |
| 855/strip | Microchip | Strip Density 855/strip |
| 96hrs. | Microchip | Test Method/Condition JESD22-A118, Ta = +130oC/85%RH, 96hrs. |
| A-077959 | Microchip | BD Number A-077959 rev A |
| ALAN-01IZZC624 | Microchip | PCN#: ALAN-01IZZC624 |
| ASEM262400048.000 | Microchip | ASSEMBLY LOT ASEM262400048.000 |
| ASEM262400048.000 | Microchip | ASEM262400048.000 Passed |
| C194 | Microchip | Material C194 |
| G770HCD | Microchip | MC Part Number G770HCD |
| J-STD-020 | Microchip | Test Method/Condition JEDEC J-STD-020 and JESD22-A113, MSL Level 1 soak at |
| JESD22-A103 | Microchip | Test Method/Condition JESD22-A103, Ta = +150 oC, 1000 hrs |
| JESD22-A104 | Microchip | Test Method/Condition JESD22-A104, Ta = -65oC/+150 oC, 500 cycles. |
| JESD22-A110 | Microchip | Test Method/Condition JESD22-A110, Ta = +130oC/85%RH, 96 hrs. Vdd = 12V |
| JESD22-A113 | Microchip | Test Method/Condition JEDEC J-STD-020 and JESD22-A113, MSL Level 1 soak at |
| JESD22-A118 | Microchip | Test Method/Condition JESD22-A118, Ta = +130oC/85%RH, 96hrs. |
| MCSO526058486.100/5B0286 | Microchip | WAFER LOT MCSO526058486.100/5B0286 |
| MD1210 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, |
| MD1210 | Microchip | fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and |
| MD1210 | Microchip | location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device |
| MD1211 | Microchip | location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device |
| MD1211 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, |
| MD1211 | Microchip | fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and |
| MD1213 | Microchip | fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and |
| MD1213 | Microchip | location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device |
| MD1213 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, |
| MD1711 | Microchip | fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and |
| MD1711 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, |
| MD1711 | Microchip | location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device |
| MD1810 | Microchip | location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device |
| MD1810 | Microchip | MD1811, and MD1810 device families of 69K technology available in |
| MD1810 | Microchip | MD1810 device families of 69K technology available in various packages. |
| MD1811 | Microchip | location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device |
| MD1811 | Microchip | fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and |
| MD1811 | Microchip | MD1811, and MD1810 device families of 69K technology available in |
| ML0220263984 | Microchip | Document Control Number ML0220263984 |
| MSL-1 | Microchip | MSL information MSL-1 |
| MSL1 | Microchip | c. Unbiased HAST post MSL1 Preconditioning. |
| MSL1 | Microchip | a. Package Preconditioning MSL1 |
| MSL1 | Microchip | b. HAST Post MSL1 Preconditioning. |
| MSL1 | Microchip | QUAL TESTS HTSL, MSL1, HAST, UHAST, TC |
| MSL1 | Microchip | d. Temperature Cycling post MSL1 Preconditioning |
| QCI-39000 | Microchip | QCI-39000, “Worldwide Quality Conformance Requirements. |
| QMI519 | Microchip | Die Attach Part Number QMI519 |
| VM1C | Microchip | qualification of VM1C process fabricated at Fab 5 (Colorado Spring), following guidelines established |
| VM1C | Microchip | with VM1C material fabricated at Fab 5 as per guidelines established in Microchip specification |
| MD1210 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families |
| MD1211 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families |
| MD1213 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families |
| MD1711 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families |
| MD1810 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families |
| MD1811 | Microchip | new fabrication location for MD1711, MD1211, MD1210, MD1213, MD1811, and MD1810 device families |