PackageDO-35
MountingThrough Hole
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Technical Specifications
EIC Semiconductor BZX55C200 technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DO-204-AH |
| Package/Case | DO-35 |
| Package Description | Axial Lead Package |
| Lead Shape | Through Hole |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 3.8(Max) |
| Package Diameter (mm) | 2(Max) |
| Package Material | Glass |
| Mounting | Through Hole |
| Jedec | DO-204AH |
| Configuration | Single |
| Nominal Zener Voltage | 200V |
| Maximum Zener Impedance | 2000Ohm |
| Zener Voltage Tolerance | 6% |
| Maximum Power Dissipation | 500mW |
| Maximum Reverse Leakage Current | 10uA |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 175°C |
Compliance
| Cage Code | 37JK6 |
| EU RoHS | Yes |
| HTS Code | 8541100050 |
| Schedule B | 8541100050 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
EIC Semiconductor BZX55C200 Datasheet
Download the complete datasheet for EIC Semiconductor BZX55C200 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.