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Search Results for "89H12NT12G2ZCHLG8"

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89H12NT12G2ZCHLG8

12-Port Gen2 PCIe Ball Grid Array Switch

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

89H12NT12G2ZCHLG8

Integrated Device Technology

FCBGA-324, Reel

,

Transferred

Pin Count: 324

uPs/uCs/Peripheral ICs Type: BUS CONTROLLER, PCI

89H12NT12G2ZCHLGI8

PCI Express Switch System Interconnect Switch 12Lanes 12 Port 324-Pin FCBGA T/R

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

89H12NT12G2ZCHL8

12-Port Gen2 System Interconnect Switch, 324-Ball FCBGA, Surface Mount

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

89H12NT12G2ZCHLI8

PCI Express Switch System Interconnect Switch 12Lanes 12 Port 324-Pin FCBGA T/R

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: FCBGA

Package Description: Flip Chip Ball Grid Array

89H12NT12G2ZCHLG

PCIE SWITCH

Volume Production

Package/Case: FCBGA

Contact Plating: Copper, Tin, Silver

Data Rate: 96Gbps

Interface: PCI Express

89H12NT12G2ZCHLG

Integrated Device Technology

FCBGA-324, Tray

BGA, BGA324,18X18,40

Transferred

Max Operating Temperature: 70

Number of Terminals: 324

Min Operating Temperature: 0

Terminal Position: BOTTOM

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