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LDC211G8814B-027

Chip Multilayer Hybrid Couplers/Chip Multilayer Hybrid Dividers

SMD

LTB

Package Family Name: SMD

Package/Case: CSMD

Package Description: Ceramic Surface Mount Device

Pin Count: 6

LDC211G8914B-027

Signal Conditioning 0805 1.89GHz 14dB Hybrid Coupler

Volume Production

Package/Case: 0805

Frequency: 1.89GHz

Impedance: 50R

Max Operating Temperature: 85°C