Search Results for &quot; LPC1114LVFHI33303 &quot;

LPC1114LVFHI33 - 32kB flash, 8kB SRAM, ADC, HVQFN32 package QFN 32-Pin

QCCN, LCC32,.2SQ,20

Active

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Interface: I2C, SPI, UART, USART, SSP

+19

LPC1114LVFHN24/103

32-bit ARM Cortex-M0 MCU, 50MHz, 32KB Flash, 4KB SRAM, QFN-24

QCCN, LCC24,.16SQ,20

Active

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Interface: I2C, SPI, UART, USART, SSP

+20

LPC1114LVFHN24/303

32-bit ARM Cortex-M0 MCU, 50MHz, 32KB Flash, 8KB SRAM, QFN-24

QCCN, LCC24,.16SQ,20

Active

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Interface: I2C, SPI, UART, USART, SSP

+20

LPC1114FA44/301

MCU 32-bit ARM Cortex M0 50MHz 32KB Flash 44-Pin PLCC SMT

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: LCC

Package/Case: PLCC

Package Description: Plastic Leaded Chip Carrier

+38

LPC1114FN28/102

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PDIP28, PLASTIC, SOT117-1, MO-015, DIP-28, Microcontroller

DIP, DIP28,.6

Active

Package/Case: SOT-117-1

Number of ADC Channels: 6

Number of Bits: 32

Number of GPIO: 22

LPC1114FHI33/302,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 32-Pin HVQFN EP

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1114FHN33/301,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 32-Pin HVQFN

Surface Mount

Active

Package/Case: HVQFN EP

Pin Count: 32

PCB: 32

Package Length (mm): 7

+33

LPC1114FHN33/303

32-Bit RISC MCU, 50MHz, FLASH, 33-Pin, Industrial, 1.8-3.6V

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Max Operating Temperature: 85

Number of Terminals: 33

Min Operating Temperature: -40

Terminal Position: QUAD

+20

LPC1114FHI33/303

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

HVQCCN,

Active

Package/Case: SOT-617-3

Number of ADC Channels: 8

Number of Bits: 32

Number of GPIO: 28

LPC1114FDH28/102:5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 28-Pin TSSOP

Lead-Frame SMT

Active

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

LPC1114FHI33/303,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 8KB RAM, 32-Pin HVQFN

Non-Lead-Frame SMT

Active

Basic Package Type: Non-Lead-Frame SMT

Package Family Name: QFN

Package/Case: HVQFN EP

Package Description: Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad

LPC1114FBD48/301,1

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 8KB RAM, LQFP-48

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1114FBD48/302,1

32-bit ARM MCU, 50MHz, 32KB Flash, 8KB RAM, LQFP48

QFP, QFP48,.35SQ,20

Active

Package/Case: LQFP

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

LPC1114FHN33/202,5

32-bit ARM MCU, 50MHz, 32KB Flash, 4KB RAM, HVQFN32

HVQCCN, LCC32,.27SQ,25

Active

Core Architecture: ARM

Data Bus Width: 32b

Frequency: 50MHz

Height: 1mm

+26

LPC1114FHN33/202

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller

7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33

Active

Package/Case: SOT-865-3

Frequency: 50MHz

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

+12

LPC1114FBD48/301:1

IC MCU 32BIT 32KB FLASH 48LQFP

Volume Production

Package/Case: LQFP

Core Architecture: ARM

Data Bus Width: 32b

Interface: I2C, SPI, UART, USART

+11

LPC1114FBD48/302

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT313-2, MS-026, LQFP-48, Microcontroller

LFQFP,

Active

Package/Case: SOT-313-2

Frequency: 50MHz

Max Supply Voltage: 3.6V

Memory Size: 32KB

LPC1114FDH28/102,5

32-bit ARM Cortex M0 MCU, 50MHz, 32KB Flash, 28-Pin TSSOP

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: SOP

Package/Case: TSSOP

Package Description: Thin Shrink Small Outline Package

LPC1114FBD48/333,1

32-bit ARM Cortex M0 MCU, 50MHz, 56KB Flash, 8KB RAM, 48-Pin LQFP

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)

LPC1114FBD48/323,1

32-bit ARM Cortex M0 MCU, 50MHz, 48KB Flash, 48-Pin LQFP

Surface Mount

Active

Package/Case: LQFP

Pin Count: 48

PCB: 48

Package Length (mm): 7.1(Max)