Search Results for &quot; MCIMX351AJQ5C &quot;

SoC i.MX35 ARM1136JF-S 532MHz 32-bit 128KB RAM 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, MAP-BGA, 400-Pin

Ball Grid Array

NRND

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Lead Shape: Ball

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400

Transferred

Search Results for "MCIMX351AJQ5C"

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SoC i.MX35 ARM1136JF-S 532MHz 32-bit 128KB RAM 400-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

SPECIALTY CONSUMER CIRCUIT, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

LFBGA,

Transferred

Number of Terminals: 400

Terminal Position: BOTTOM

JEDEC Package Code: S-PBGA-B400

Width: 17

i.MX35 SoC, ARM1136JF-S, 532MHz, 32-bit, MAP-BGA, 400-Pin

Ball Grid Array

NRND

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Lead Shape: Ball

i.MX35 32-bit MPU, ARM1136JF-S core, 532MHz, MAPBGA 400