Analog Circuit, Hybrid, MDIP10,
Pneumatic gripper 0.15. . .0.6 MPa -10. . .+60 °C, MHL2-10D, SMC
Gripper; Wide Opening; Double Acting; Bore Size: 25mm; Stroke: 50mm; 0.1-0.6 MPa
Pneumatic gripper 0.1. . .0.6 MPa -10. . .+60 °C, MHL2-20D, SMC
Pneumatic gripper 0.1. . .0.6 MPa -10. . .+60 °C, MHL2-16D2, SMC
Wide Band High Power Amplifier, 800MHz Min, 925MHz Max, Hybrid, CASE 301AP-02, 4 PIN
Narrow Band High Power Amplifier, 1800MHz Min, 1900MHz Max, 1 Func, CASE 301AP-02, 4 PIN
1900MHz - 2000MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER, LEAD FREE, CASE 301AP-02, 4 PIN
Inductor RF Chip Multi-Layer 0.082uH 5% 8Q-Factor Ceramic 0.1A 1.6Ohm DCR 0402 T/R
Inductor RF Chip Multi-Layer 0.22uH 5% 12Q-Factor Ceramic 0.3A 1.2Ohm DCR 0805 T/R
Inductor RF Chip Multi-Layer 0.01uH 5% 8Q-Factor Ceramic 0.3A 0.26Ohm DCR 0603 T/R
Inductor RF Chip Multi-Layer 0.056uH 5% 12Q-Factor Ceramic 0.3A 0.75Ohm DCR 0603 T/R
Inductor RF Chip Multi-Layer 0.033uH 5% 10Q-Factor Ceramic 0.3A 0.55Ohm DCR 0603 T/R
Inductor RF Chip Multi-Layer 0.015uH 5% 8Q-Factor Ceramic 0.3A 0.32Ohm DCR 0603 T/R
Inductor RF Chip Multi-Layer 0.0033uH 0.3nH 8Q-Factor Ceramic 0.3A 0.19Ohm DCR 0402 T/R
Inductor RF Chip Multi-Layer 0.0015uH 0.3nH 8Q-Factor Ceramic 0.6A 0.1Ohm DCR 0603 T/R
Inductor RF Chip Multi-Layer 0.022uH 5% 8Q-Factor Ceramic 0.3A 0.8Ohm DCR 0402 T/R
Inductor RF Chip Multi-Layer 0.022uH 5% 10Q-Factor Ceramic 0.3A 0.4Ohm DCR 0603 T/R
Inductor RF Chip Multi-Layer 0.018uH 5% 10Q-Factor Ceramic 0.3A 0.35Ohm DCR 0603 T/R
