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32-bit ARM Cortex M4 MCU, 100MHz, 512KB Flash, 144-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

32-Bit RISC MCU, 100MHz, 512KB Flash, 128KB RAM, PBGA144

13 X 13 MM, MAPBGA-144

Active

Max Operating Temperature: 105

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

32-bit ARM Cortex M4 MCU, 512KB Flash, 144-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

32-Bit RISC MCU, 100MHz, 512KB Flash, 128KB RAM, PBGA121

8 X 8 MM, MAPBGA-121

Active

Max Operating Temperature: 105

Number of Terminals: 121

Min Operating Temperature: -40

Terminal Position: BOTTOM

MK40DN512ZVMD10

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144

MAPBGA-144

Not Recommended

Max Operating Temperature: 105

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

MK60DN512VMD10 Microcontroller Tower System Module 100MHz CPU 128KB RAM 512KB Flash

Active

Type: Tower System Module

Supported Device: MK60DN512VMD10

Supported Device Technology: Microcontroller

Maximum Clock Rate: 100MHz

TWR-K60D100M-KIT

FREESCALE SEMICONDUCTOR TWR-K60D100M-KIT TOWER MODULE, ARM, MK60DN512VMD10

Volume Production

Package/Case: Module

Core Architecture: ARM

Evaluation Kit: Yes

Number of Bits: 32