Search Results for &quot; PC7410MGU500LE &quot;

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 360

Min Operating Temperature: -55

Terminal Position: BOTTOM

PC7410MG500LE

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Frequency: 500MHz

Max Frequency: 500MHz

PC7410MGH500LE

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Frequency: 500MHz

Max Frequency: 500MHz

PC7410MG400LE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Max Frequency: 400MHz

Max Operating Temperature: 125°C

PC7410MG500NE

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 360

Min Operating Temperature: -55

Terminal Position: BOTTOM

PC7410MGH450NE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Max Frequency: 450MHz

Max Operating Temperature: 125°C

PC7410MGS400NE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, CGA360,19X19,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 360

Min Operating Temperature: -55

Terminal Position: BOTTOM

PC7410MGS400LE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, CGA360,19X19,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 360

Min Operating Temperature: -55

Terminal Position: BOTTOM

PC7410VGU500LE

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA160,14X14,32

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

PC7410VG450NE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Max Frequency: 450MHz

Max Operating Temperature: 110°C

PC7410VG450LE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Max Frequency: 450MHz

Max Operating Temperature: 110°C

PC7410VGS450NE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, CGA360,19X19,50

Obsolete

Description: MPU 7410 RISC 64-Bit 0.18um 450MHz 1.8V/2.5V/3.3V 360-Pin CI-CGA

PC7410VGU400NE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

Obsolete

Core Architecture: PowerPC

Frequency: 500MHz

Max Operating Temperature: 110°C

Min Operating Temperature: -40°C

PC7410VGU400LE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

Atmel

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Transferred

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

PC7410VGSU450LE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, CGA360,19X19,50

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

LKG Industries

Res POT 10K Ohm 20% 0.2W(1/5W) 1(Elec)/1(Mech)Turn 6mm (39.4 X 17 X 31.5mm) Pin Thru-Hole

Through Hole

Active

Mounting: Through Hole

Termination Style: Pin

Shaft Diameter (mm): 6

Product Length (mm): 39.4

+10

Linear POTENTIOMETER-10K

Unknown

Mount: Through Hole

Resistance: 10kR

Termination: Pin

Tolerance: 20%

PC745

Linear POTENTIOMETER/SW.-10K

Unknown

Mount: Panel

Resistance: 10kR

Termination: Solder

Tolerance: 20%

Search Results for "PC7410MGU500LE"

Filters

PC7410MGU500LE

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 360

Min Operating Temperature: -55

Terminal Position: BOTTOM

PC7410MG500LE

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Frequency: 500MHz

Max Frequency: 500MHz

PC7410MGH500LE

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Frequency: 500MHz

Max Frequency: 500MHz

PC7410MG400LE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Max Frequency: 400MHz

Max Operating Temperature: 125°C

PC7410MG500NE

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 360

Min Operating Temperature: -55

Terminal Position: BOTTOM

PC7410MGH450NE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Max Frequency: 450MHz

Max Operating Temperature: 125°C

PC7410MGS400NE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, CGA360,19X19,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 360

Min Operating Temperature: -55

Terminal Position: BOTTOM

PC7410MGS400LE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, CGA360,19X19,50

Obsolete

Max Operating Temperature: 125

Number of Terminals: 360

Min Operating Temperature: -55

Terminal Position: BOTTOM

PC7410VGU500LE

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA160,14X14,32

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

PC7410VG450NE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Max Frequency: 450MHz

Max Operating Temperature: 110°C

PC7410VG450LE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Max Frequency: 450MHz

Max Operating Temperature: 110°C

PC7410VGS450NE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, CGA360,19X19,50

Obsolete

Description: MPU 7410 RISC 64-Bit 0.18um 450MHz 1.8V/2.5V/3.3V 360-Pin CI-CGA

PC7410VGU400NE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

Obsolete

Core Architecture: PowerPC

Frequency: 500MHz

Max Operating Temperature: 110°C

Min Operating Temperature: -40°C

PC7410VGU400LE

RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

Atmel

RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, BGA360,19X19,50

Transferred

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

PC7410VGSU450LE

RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360

BGA, CGA360,19X19,50

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

LKG Industries

Res POT 10K Ohm 20% 0.2W(1/5W) 1(Elec)/1(Mech)Turn 6mm (39.4 X 17 X 31.5mm) Pin Thru-Hole

Through Hole

Active

Mounting: Through Hole

Termination Style: Pin

Shaft Diameter (mm): 6

Product Length (mm): 39.4

+10

Linear POTENTIOMETER-10K

Unknown

Mount: Through Hole

Resistance: 10kR

Termination: Pin

Tolerance: 20%

PC745

Linear POTENTIOMETER/SW.-10K