Search Results for &quot; PEB3331HTV2.2 &quot;

IC CODEC VOIP 100-TQFP

Obsolete

Package/Case: LQFP

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 1

PEB3331HTV2.1

IC CODEC VOIP TQFP-100

Obsolete

Package/Case: LQFP

Interface: Serial, Parallel

Lead Free: Lead Free

Mount: Surface Mount

PEB3332HTV2.2

IC CODEC VOIP 100-TQFP

Obsolete

Package/Case: LQFP

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 2

PEB3332EL-V14

Analog Telephony Solution 40Kbps 144-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

+13

PEB33321ELV2.2-G

IC CODEC VOIP 144-LBGA

Obsolete

Package/Case: LBGA

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 1

PEB33322ELV2.2-G

IC CODEC VOIP 144-LBGA

Obsolete

Package/Case: LBGA

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 2

Analog Telephony Solution 40Kbps 176-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3324EV1.4-G

IC CODEC VOIP 176-LBGA

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 400mW

PEB3341FV2.1

IC CODEC VOIP 100-TQFP

Obsolete

Package/Case: LQFP

Mount: Surface Mount

Number of Circuits: 1

Package Quantity: 1900

PEB3324E-V14

Analog Telephony Solution 40Kbps 176-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3394EV1.4

Voice and Internet Enhanced Telephony Interface Concept

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

IC CODEC VOIP LBGA-176

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 400mW

PEB3341FV2.2

IC CODEC VOIP 100-TQFP

Obsolete

Package/Case: LQFP

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 1

PEB3314EV1.4

Analog Telephony Solution 40Kbps 176-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3322E-V14

Voice and Internet Enhanced Telephony Interface Concept

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

PEB3320E-V14

Analog Telephony Solution 40Kbps 176-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3394HLV1.4

Voice and Internet Enhanced Telephony Interface Concept

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

PEB3324HL-V14

Analog Telephony Solution 40Kbps 176-Pin LQFP

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

PEB3304HLV1.4

Analog voice access ICs includes two, four and eight-channel codec

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

PEB3324HLV1.4

IC CODEC VOIP LQFP-176

Obsolete

Package/Case: LQFP

Lead Free: Lead Free

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Search Results for "PEB3331HTV2.2"

Filters

PEB3331HTV2.2

IC CODEC VOIP 100-TQFP

Obsolete

Package/Case: LQFP

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 1

PEB3331HTV2.1

IC CODEC VOIP TQFP-100

Obsolete

Package/Case: LQFP

Interface: Serial, Parallel

Lead Free: Lead Free

Mount: Surface Mount

PEB3332HTV2.2

IC CODEC VOIP 100-TQFP

Obsolete

Package/Case: LQFP

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 2

PEB3332EL-V14

Analog Telephony Solution 40Kbps 144-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

+13

PEB33321ELV2.2-G

IC CODEC VOIP 144-LBGA

Obsolete

Package/Case: LBGA

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 1

PEB33322ELV2.2-G

IC CODEC VOIP 144-LBGA

Obsolete

Package/Case: LBGA

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 2

Analog Telephony Solution 40Kbps 176-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3324EV1.4-G

IC CODEC VOIP 176-LBGA

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 400mW

PEB3341FV2.1

IC CODEC VOIP 100-TQFP

Obsolete

Package/Case: LQFP

Mount: Surface Mount

Number of Circuits: 1

Package Quantity: 1900

PEB3324E-V14

Analog Telephony Solution 40Kbps 176-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3394EV1.4

Voice and Internet Enhanced Telephony Interface Concept

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

IC CODEC VOIP LBGA-176

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 400mW

PEB3341FV2.2

IC CODEC VOIP 100-TQFP

Obsolete

Package/Case: LQFP

Interface: Serial, Parallel

Mount: Surface Mount

Number of Circuits: 1

PEB3314EV1.4

Analog Telephony Solution 40Kbps 176-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3322E-V14

Voice and Internet Enhanced Telephony Interface Concept

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

PEB3320E-V14

Analog Telephony Solution 40Kbps 176-Pin LBGA

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

PEB3394HLV1.4

Voice and Internet Enhanced Telephony Interface Concept

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

PEB3324HL-V14

Analog Telephony Solution 40Kbps 176-Pin LQFP

Lead-Frame SMT

Unconfirmed

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

PEB3304HLV1.4

Analog voice access ICs includes two, four and eight-channel codec

Lead-Frame SMT

Obsolete

Basic Package Type: Lead-Frame SMT

Package Family Name: QFP

Package/Case: LQFP

Package Description: Low Profile Quad Flat Package

PEB3324HLV1.4

IC CODEC VOIP LQFP-176