General-purpose 2.4 GHz Wi-Fi and Bluetooth LE MCU module integrates a single-core 32-bit RISC-V processor running up to 160 MHz. The module includes an on-board PCB antenna, up to 15 GPIOs, and common peripherals including SPI, UART, I2C, I2S, LED PWM, TWAI, USB serial/JTAG, ADC, timers, and a temperature sensor. It operates from a 3.0 V to 3.6 V supply and is available in ambient-temperature variants rated for -40 °C to 85 °C or -40 °C to 105 °C. The module measures 13.2 mm by 16.6 mm by 2.4 mm and carries RoHS and REACH green certification.
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| Wireless standard | IEEE 802.11b/g/n, Bluetooth LE 5 |
| Processor core | 32-bit RISC-V single-core |
| Processor frequency | Up to 160MHz |
| ROM | 384KB |
| SRAM | 400KB |
| RTC SRAM | 8KB |
| Flash | Up to 8 in chip packageMB |
| GPIO count | Up to 15 |
| Wi-Fi channel center frequency | 2412 to 2484MHz |
| Wi-Fi data rate | Up to 150Mbps |
| Bluetooth LE data rates | 0.125, 0.5, 1, 2Mbps |
| Bluetooth LE channel frequency | 2402 to 2480MHz |
| Supply voltage | 3.0 to 3.6V |
| Operating ambient temperature | -40 to 85 or -40 to 105, variant dependent°C |
| Module dimensions | 13.2 × 16.6 × 2.4mm |
| Antenna | On-board PCB antenna |
| Moisture sensitivity level | MSL 3 |
| ESD HBM rating | ±2000V |
| RoHS | Compliant |
| REACH | Compliant |
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