Wi-Fi and Bluetooth LE MCU module integrates an ESP32-S3 series dual-core Xtensa LX7 processor running up to 240 MHz. The module provides 8 MB Quad SPI flash, 8 MB Octal SPI PSRAM, 384 KB ROM, 512 KB SRAM, and 16 KB RTC SRAM. Wireless connectivity includes 2.4 GHz 802.11b/g/n Wi-Fi up to 150 Mbps and Bluetooth 5 LE with 125 Kbps to 2 Mbps PHY rates. The PCB-antenna module operates from a 3.0 V to 3.6 V supply over a -40 °C to 65 °C ambient range and measures 18.0 mm by 25.5 mm by 3.1 mm.
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| Processor core | Xtensa dual-core 32-bit LX7 |
| Maximum CPU frequency | 240MHz |
| Flash memory | 8 Quad SPIMB |
| PSRAM | 8 Octal SPIMB |
| ROM | 384KB |
| SRAM | 512KB |
| RTC SRAM | 16KB |
| Wi-Fi standard | 802.11b/g/n |
| Wi-Fi maximum data rate | 150Mbps |
| Wi-Fi frequency range | 2412 to 2484MHz |
| Bluetooth | Bluetooth 5 LE |
| Bluetooth LE PHY rates | 125, 500, 1000, 2000Kbps |
| Programmable GPIO | 36 |
| Power supply voltage | 3.0 to 3.6V |
| Operating ambient temperature | -40 to 65°C |
| Antenna | On-board PCB antenna |
| Dimensions | 18.0 × 25.5 × 3.1mm |
| Moisture sensitivity level | MSL 3 |
| RoHS | Compliant |
| REACH | Compliant |
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