The wireless MCU module integrates a dual-core 32-bit Xtensa LX6 processor running up to 240 MHz with 16 MB Quad SPI flash. It supports 2.4 GHz IEEE 802.11b/g/n Wi-Fi up to 150 Mbps and Bluetooth v4.2 BR/EDR plus Bluetooth LE. The module provides 26 GPIOs with UART, SPI, SDIO, I2C, I2S, ADC, DAC, touch sensing, PWM, pulse counter, IR, TWAI and other peripherals. It uses an on-board PCB antenna, operates from a 3.0 V to 3.6 V supply, and is specified for a -40 °C to 85 °C ambient temperature range. The 18.0 mm by 25.5 mm by 3.1 mm module is rated MSL 3 and is identified by Espressif as REACH and RoHS compliant.
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| Wireless standard | IEEE 802.11b/g/n; Bluetooth v4.2 BR/EDR; Bluetooth LE |
| Wi-Fi frequency band | 2.4GHz |
| Wi-Fi data rate | Up to 150Mbps |
| Processor core | Xtensa dual-core 32-bit LX6 |
| CPU clock frequency | 80 to 240MHz |
| ROM | 448KB |
| SRAM | 520KB |
| RTC SRAM | 16KB |
| Flash memory | 16 Quad SPIMB |
| PSRAM | 0MB |
| GPIO count | 26 |
| Module pins | 38 |
| Supply voltage | 3.0 to 3.6V |
| Operating ambient temperature | -40 to 85°C |
| Antenna type | On-board PCB antenna |
| Module dimensions | 18.0 x 25.5 x 3.1mm |
| Wi-Fi channel center frequency range | 2412 to 2484MHz |
| Bluetooth LE channel center frequency range | 2402 to 2480MHz |
| Bluetooth LE RF transmit power range | -12 to 9dBm |
| MSL rating | 3 |
| RoHS | Compliant |
| REACH | Compliant |
| Bluetooth Certification | BQB |
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