The wireless SoC integrates a dual-core 32-bit Xtensa LX7 microprocessor running up to 240 MHz with 2.4 GHz Wi-Fi and Bluetooth Low Energy 5 connectivity. It includes 512 KB internal SRAM and 8 MB in-package octal SPI PSRAM, with a 3.3 V VDD_SPI configuration. The device supports 45 programmable GPIOs, USB OTG full-speed, USB Serial/JTAG, SPI, I2C, I2S, UART, TWAI, LCD/camera, ADC, touch sensing, and security accelerators. The ambient operating range is -40 °C to 65 °C for this orderable variant, with higher PSRAM temperature operation possible when ECC is enabled.
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| Processor core | Dual-core 32-bit Xtensa LX7 |
| Maximum CPU frequency | 240MHz |
| Internal SRAM | 512KB |
| In-package PSRAM | 8MB |
| PSRAM interface | Octal SPI |
| In-package flash | None |
| Wi-Fi standard | IEEE 802.11 b/g/n, 2.4 GHz |
| Wi-Fi channel bandwidth | 20/40MHz |
| Bluetooth | Bluetooth 5 Low Energy |
| Bluetooth PHY | 1 Mbps, 2 Mbps, Coded PHY |
| Programmable GPIO | 45 |
| VDD_SPI voltage | 3.3V |
| Ambient operating temperature | -40 to 65°C |
| Package | QFN-56 |
| USB interface | USB 2.0 OTG full-speed and USB Serial/JTAG |
| Security hardware | Secure boot, flash encryption, AES, SHA, RSA, HMAC, RNG |
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