PackageTSOP-II
MountingSurface Mount
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Technical Specifications
Everspin MR2A16AMYS35R technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-II
Package Description
Thin Small Outline Package (Type II)
Lead Shape
Gull-wing
Pin Count
44
PCB
44
Package Length (mm)
18.54(Max)
Package Width (mm)
10.29(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
4Mbit
Interface Type
Parallel
Maximum Operating Current
165mA
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3V
Max Operating Supply Voltage
3.6V
Maximum Access Time
35ns
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Compliance
Cage Code
5DHX8
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Everspin MR2A16AMYS35R Datasheet
Download the complete datasheet for Everspin MR2A16AMYS35R to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.