PackageBGA
MountingSurface Mount
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Technical Specifications
Fujitsu MB86R01PB-GSE1 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
484
PCB
484
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.66
Seated Plane Height (mm)
236(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Category
Graphic Display Controller
Maximum Data Rate
480.24Mbps
Transmission Media Type
Cable
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
3V
Power Supply Type
Analog
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
SHM48
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Fujitsu MB86R01PB-GSE1 Datasheet
Download the complete datasheet for Fujitsu MB86R01PB-GSE1 to view detailed technical specifications.
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